HARRIS 5 (L-Ag5P) 1,5 500 mm
Description
- Copper-phosphorous alloy with excellent capillary properties
- Thanks to its low viscosity, high working speeds are achieved
- Good wetting ability, ensuring tight, pore-free connections
- Applications
- For brazing points at operating temperatures of -60 °C to 150 °C
- Suitable for copper/copper or copper/copper alloy connections (brass, bronze, red bronze)
- Flux can be dispensed with due to the phosphorus content
- This solder is not suitable for use with sulphurous media or for connections involving steels (Fe) and nickel alloys
- Copper installations: electrical engineering industry, air conditioning, refrigeration systems, heat exchangers, etc.
Versions
Technical data
Standards | ISO 17672 - CuP 281 | ||||||
DIN EN 1044 - CP 104 | |||||||
DIN 8513 - L-Ag5P | |||||||
Ø | 1.5 mm | ||||||
Chemical analysis |
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Tensile strength, Rm | 250 N/mm² | ||||||
Length | 500 mm | ||||||
Melting range | 645 °C - 815 °C | ||||||
Working temperature | 740 °C | ||||||
Density | 8 g/cm³ | ||||||
Version | Square, blank |