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Oxy-acetylene equipment and gas supply

dump:
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nameShort = 'HARRIS Blockade® blank'
name = 'Blockade 2,0 500 mm'
description = '<ul class="description_list"><li class="first-item">Because it contains no silver, cost savings are immense</li><li>Unique copper alloy based on phosphorous, tin and silicon for brazing copper and brass</li><li>The probability of the brass overheating is reduced as a result of the very low working temperature</li><li>Is also often used as a cost-effective alternative to copper-phosphorous solders with 2% and 5% silver and to traditional silver solders</li><li>It is capillary-active, i.e. the braze gap fills very quickly due to the exceptional flow properties and forms a uniform concave fillet at the brazing point with a smooth surface</li><li><b>Applications</b></li><li class="knurps">For brazing points at operating temperatures of -50 °C to 150 °C</li><li class="knurps">Blockade® is particularly suitable for copper/copper connections without flux</li><li class="knurps">For copper alloys such as brass, bronze etc., a flux-coated rod or the Eco Smart<sup>®</sup> green flux is necessary</li><li class="knurps">Blockade® is not suitable for brazing steels and nickel alloys (brittle phase formation) or for use with sulphurous media</li><li class="knurps">In addition, Blockade® is suitable for all flame brazing methods as well as for induction heating and furnace brazing. Blockade® is often used in the refrigeration, air conditioning and electrical engineering industries</li></ul>'
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nameShort = 'HARRIS Dynaflow® blank'
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description = '<ul class="description_list"><li class="first-item">Free-flowing, argentiferous copper-phosphorus solder for copper/copper connections without flux and for brass and copper alloys in conjunction with the Eco Smart flux<sup>®</sup></li><li>Low melting brazing filler with very high demands on the brazing joint and good flow properties</li><li><b>Applications</b></li><li class="knurps">Dynaflow® was specially developed for refrigeration and air conditioning applications and is a cost-effective alternative to high-silver solders. </li><li class="knurps">For brazing points at operating temperatures of -70 °C to 150 °C</li><li class="knurps">Dynaflow® is also used in installation engineering and the electrical engineering industry</li><li class="knurps">Dynaflow® is not suitable for connecting steels (brittle phase formation) and for use with sulphurous media</li></ul>'
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nameShort = 'HARRIS 2 (L-Ag2P) blank'
name = 'HARRIS 2 (L-Ag2P) 1,5 500 mm'
description = '<ul class="description_list"><li class="first-item">Copper-phosphorous alloy with excellent capillary properties</li><li>Thanks to its low viscosity, high working speeds are achieved</li><li>Composition and characteristics comply with the specifications of sections GW 2 and GW 7 of the DVGW (German Technical and Scientific Association for Gas and Water)</li><li>Good wetting ability, ensuring tight, pore-free connections</li><li><b>Applications </b></li><li class="knurps">For brazing points at operating temperatures of -60 °C to 150 °C</li><li class="knurps">Suitable for copper/copper or copper/copper alloy connections (brass, bronze, red bronze)</li><li class="knurps">Flux can be dispensed with due to the phosphorus content</li><li class="knurps">This solder is not suitable for use with sulphurous media or for connections involving steels (Fe) and nickel alloys</li><li class="knurps">Copper installations: electrical engineering industry, air conditioning, refrigeration systems, heat exchangers, etc.</li></ul>'
descriptionShort = '<p>Copper-phosphorous alloy with excellent capillary properties</p>'
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description = '<ul class="description_list"><li class="first-item">Copper-phosphorous-silver alloy with very good capillary properties</li><li>Thanks to its low viscosity, high working speeds are achieved</li><li>Good wetting ability, ensuring tight, pore-free connections</li><li>High ductility (plastic deformability) even at low temperatures</li><li><b>Applications</b></li><li class="knurps">For brazing points at operating temperatures of -70 °C to 150 °C</li><li class="knurps">Suitable for copper/copper or copper/copper alloy connections (brass, bronze, red bronze)</li><li class="knurps">Flux can be dispensed with due to the phosphorus content</li><li class="knurps">This solder is not suitable for use with sulphurous media or for connections involving steels (Fe) and nickel alloys</li><li class="knurps">Copper installations: electrical engineering industry, air conditioning, refrigeration systems, heat exchangers, etc.</li></ul>'
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An error occurred
Successfully completed
current mapping: categories